About AWSC
Technology Information
InGap/GaAs HBT
InP HBT
Backside Via
Quality Assurance
Backside
Foundry Service
Human Resource
news
contact us
eService
Backside Via Process Flow
e_backside_flow.gif (3476 bytes)
Key Features of Backside Via Process
  • 100 um in Wafer Thickness
  • 60 um Diameter Via Hole
  • Plated Au of 5 um in Thickness

e_backside_hole.gif (19412 bytes)

[ Home ] [ About AWSC ] [ Technology Information ] [ Quality Assurance ] [ Foundry Service ] [ Human Resource ] [ News ] [Contact Us] [eService]

Sed mail to service@awsc.com.tw with question or comments about this web site.
Copyright 2001 Advanced Wireless Semiconductor Commpany
Last modifired: 2005/03/11