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Backside Via
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Backside
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Backside Via Process Flow
e_backside_flow.gif (3476 bytes)
Key Features of Backside Via Process
  • 100 um in Wafer Thickness
  • 50 um Diameter Via Hole
  • 5 um Au Plating in Thickness

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Copyright 2001 Advanced Wireless Semiconductor Commpany
Last modifired: 2009/04/08