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Backside
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Backside Via Process Flow
e_backside_flow.gif (3476 bytes)
Key Features of Backside Via Process
  • 100 um in Wafer Thickness
  • 20x40um Rectangle and 42um Diameter Round Via Hole
  • Smaller Via Size To Reduce Chip Size
  • Plated 4.5 um Copper/Gold in Thickness

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Copyright 2001 Advanced Wireless Semiconductor Commpany
Last modifired: 2011/11/21