Backside Via Process Flow Key Features of Backside Via Process 100 um in Wafer Thickness 20x40um Rectangle and 42um Diameter Round Via Hole Smaller Via Size To Reduce Chip Size Plated 4.5 um Copper/Gold in Thickness
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Send mail to webmaster@awsc.com.tw with question or comments about this web site. Copyright 1999 Advanced Wireless Semiconductor Commpany Last modifired: 2011/11/21
