Cu Pillar Bump
Features
- Copper Pillar Bump Process For Assembly
- Bump Metal Cu/Ni/SnAg
- Production Minimum Bump Size 55um
- Bump Height 65um After Reflow, Chip Thickness 175um or 150um
- Bump Height 50um After Reflow, Chip Thickness 150um
- Bump Bar Pillar: 700um Maximum Length with Aspect Ratio < 7
Specification
| Parameter |
Typical |
Unit |
| Bump Size |
55 |
um |
| Bump Height |
50/65 |
um |
| Chip Thickness |
150/175 |
um |
Before Reflow
After Reflow
