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Product Summary

InGaP HBT

Technology Description Application
HBT226 High Beta 120, Build-in EMTR Resistor ED-FET (W)CDMA ; LTE ; WiFi 11.ac/ax ; FET for Bias Control
HBT228 High Beta 120, High Linearity Edge ; (W)CDMA ; LTE ; WiFi 11.ac/ax, Gain Block
HBT229 High Beta 120, High Breakdown 18V and High ruggedness GSM, Gain Block, Infrastructure

GaAs HEMT

Technology Description Application
0.5um
D-pHEMT
(SW6)
0.5 um Optical Gate Stepper Lithography; Low Insertion Loss and High Isolation Switch ; Low Noise Amplifiers
0.5um
ED pHEMT
(P50ED)
0.5 um Optical T-Gate Process ; Low Ron and Low Gate Capacitance ; High ESD Protection Diode Switch ; Low Noise Amplifiers
0.25um
ED pHEMT
(P25ED)
0.25um T-Gate Depletion / Enhancement Mode FET Switch ; LNA ; Pre-5G: Sub-6GHz
0.15um
E pHEMT
(P15ED)
Optical Lithorgraphy 0.15um T-Gate Enhancement Mode FET Switch ; LNA ; Pre-5G: Sub-6GHz ; 5G (Upto 28 GHz); LNB
0.25um
ED Bi-HEMT
(EDB25)
Highly Integration For PA+SW+LNA WiFi ; Entry Level 5G

IPD

Technology Description Application
IPD Resistor, Inductor and High Q Process Passive Component; Metal to 9um in Thickness

Optical

Technology Description Application
VCSEL High Performance Optical Device Sensor (ToF) ; 3D Sensing ; AR/VR ; AutoDrive
CPV Solar High Efficiency Worldwide First 6" Wafer Solar Power Plant

Flip-Chip on GaAs Wafer

Technology Description Application
Cu Pillar Bump Reliable Bumping Prcess on GaAs Wafer Replaceing Wire Bond

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