Cu Pillar Bump

Features

- Copper Pillar Bump Process For Assembly
- Bump Size 85um
- Bump Spacing 140um (Bump cente to Center)
- Bump Height 65um
- Bump Metal Cu/Ni/SnAg
- Chip Thickness 175um

Specification

Parameter	Typical	Unit
Bump Size	85	um
Pillar Thickness	>65	um
Chip Thickness	>175	um

Before Reflow

After Reflow