| 2023/08 | Completion of the development of the HBT PA technology in the Ku-Band for Low-Earth Orbit (LEO) satellites at 7GHz - 15GHz | | 2023/03 | Passed the 228-hour uHAST HBT reliability test |
| 2023/01 | Able to prepare financail statements |
| 2022/10 | Completed Filter Process Development |
| 2022/08 | Officially A Subsidiary Company of SAS (5483TT) |
| 2022/03 | Qualified by LEO Customer, 0.15um pHEMT for LNA |
| 2022/03 | Reliability Test bHAST Been Approved Passed 192 Hour |
| 2022/02 | VCSEL AR/VR Process Qualified and Start Production |
| 2021/12 | 0.25um ED pHEMT Qualified by Multiple Customers and Start Production |
| 2021/12 | 5G N77/N79 HBT + Bump Process Qualified by US Fabless Customer and Start Production |
| 2021/09 | Expand Capacity Up To 15,000 Wafers Per Month |
| 2021/06 | 5G N41 HBT Process Qualified by China Customers and Start Production |
| 2020/08 | Completed Private Placement of 45 Million shares, with a total of 199.7 Million Common Stock Shares |
| 2020/03 | Completed Re-Cap of 10 Million shares, with a total of 154.7 Million Common Stock Shares |
| 2019/06 | Completed VCSEL bottom emitting process development and certified by automobile application |
| 2019/02 | Completed 5G (Sub-6GHz) PDK |
| 2018/10 | Completed RBA (Responsible Business Alliance) Validated Assessment Program (VAP) |
| 2018/09 | Completed 0.15um E pHEMT PDK |
| 2018/08 | Got the Reward of Excellent Company from Ministry of Finance |
| 2018/02 | Completed 0.25um ED BiHEMT PDK |
| 2017/12 | IATF 16949 Certified |
| 2017/12 | ISO With Year 2015 Certified |
| 2017/10 | Completed 0.25um ED pHEMT PDK |
| 2017/06 | Completed 0.25um ED pHEMT Process Development |
| 2017/03 | LD VCSEL Technology Been Qualified By Customers |
| 2016/11 | Bump Process Been Qualified By US Customer |
| 2016/09 | Became EICC Membership |
| 2016/09 | Completed LD VCSEL Process Development |
| 2016/06 | Completed HBT226/228/229 PDK |
| 2016/02 | Completed Bump Process Development |
| 2015/12 | Start Mass Production E/D pHEMT wafers |
| 2014/12 | Capacity Up To 3,000 Wafers Out Per Week |
| 2013/12 | Completed BiHEMT, E/D pHEMT Process Development |
| 2012/03 | Fully Converted to 6-inch Wafer Production |
| 2012/02 | Got The Best Supplier Award for External Foundry from Skyworks Solution |
| 2011/12 | Passed CG6006 General Assessment Criteria by TAIWAN CORPORATE GOVERNANCE ASSOCIATION |
| 2011/10 | Passed AEO (Authorized Economic Operator) Certification |
| 2011/09 | Shipped More Than 2,000 6-inch CPV Wafers |
| 2011/07 | Qualified BiFET Process |
| 2011/04 | Shipped More Than 2000 6-inch Wafers in April, 2011 |
| 2011/01 | Completed 6-inch GaAs CPV Solar Cell FAB |
| 2010/09 | Completed 3rd Floor Construction |
| 2010/06 | More than 1300 pHEMT Wafers Shipped in One Month |
| 2010/05 | More than 7000 Wafers Shipped in One Month |
| 2010/04 | Complete 6" FAB Expansion; Total Capacity of 1600 Wafers in One Month |
| 2010/01 | Complete Solar Cell Process Qualification |
| 2009/12 | Completed Re-Cap of 10Million Shares, with a total of 123.9 Million Common Stock Shares. |
| 2009/09 | Passed first tier customer's 6 inch product qualification |
| 2009/06 | IPO |
| 2009/05 | Completed Re-Cap of 13.4 Million Shares; with a total of 113.9 Million Common Stock Shares |
| 2008/12 | Achieved NTD $1.09 EPS for 2008 |
| 2008/09 | Completed 6" Pilot Line |
| 2007/02 | Completed FAB Expansion; Total Capacity of 1600 4" HBT Wafers |
| 2006/07 | Completed Re-Cap of 20 Million Shares; with Total of 100 Million Common Stock Shares |
| 2006/03 | More than 4200 Wafers Shipped in One Month |
| 2005/12 | Profitable for 2005 |
| 2005/09 | More than 2700 Wafers Shipped in One Month |
| 2005/06 | Achieve BEP in Month of June |
| 2005/01 | Offer GaAs PIN Diode Process |
| 2005/01 | Offer InP Power Process |
| 2004/12 | Over 37 Million Power Amplifier Chips Delivered |
| 2004/09 | Offer pHEMT Switch Process |
| 2004/08 | Offer Monthly Low NRE Shuttle Mask Services |
| 2004/07 | Over 10 Million Cellular Power Amplifier Chips Delivered |
| 2004/07 | Over 15 Million WLAN Power Amplifier Chips Delivered |
| 2004/05 | Completed the First Phase of InP Government Project |
| 2003/12 | ISO 9001 Re-Certified With Year 2000 Version |
| 2003/05 | Over 2 Million WLAN Power Amplifier Chips Delivered |
| 2003/02 | Production Ramp Up for WLAN Products |
| 2003/01 | Over 1 Million Cellular Power Amplifier Chips Delivered |
| 2002/11 | InP Government Project Granted |
| 2002/10 | Achieved Production Yield and Cycle Time Targets |
| 2002/07 | Started Production Ramp for Skyworks |
| 2002/05 | Passed Quality Audit by Skyworks |
| 2002/03 | Passed Skyworks Process Qualification |
| 2001/12 | New Technology Released to Public |
| 2001/11 | ISO14001 Certified |
| 2001/10 | Awarded by Industrial Development Bureau, Ministry of Economic Affairs, as Superior Demonstration Team of Environment Management System |
| 2001/07 | Passed Customer Audit |
| 2001/05 | InGaP OEIC Foundry Process Qualified |
| 2001/04 | Started IPO Process |
| 2001/03 | HBT Octagonal Layout Patent Granted by Taiwan |
| 2001/01 | Delivered InGaP OEIC Wafers to Customer |
| 2000/12 | ISO9002 Certified |
| 2000/11 | Qualified InGaP HBT Foundry Process |
| 2000/09 | Developed TWV Foundry Process |
| 2000/07 | InGaP Government Project Granted by Government |
| 2000/06 | Production PROMIS System Implemented |
| 2000/05 | TWV Innovation Government Project Granted |
| 2000/04 | Qualified AlGaAs HBT Process |
| 2000/02 | AlGaAs Innovation Government Project Granted |
| 1999/12 | Delivered First Customer Lot |
| 1999/07 | Fab Opening Ceremony |
| 1999/06 | First Yielded HBT Wafer Out |
| 1999/04 | CleanRoom Completed and Certified |